Contents
List of AMD mobile processors
Features overview
CPUs
APUs
Initial platform (2003)
Launched in 2003, the initial platform for mobile AMD processors consists of:
Mobile Sempron
"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
"Dublin" (Socket 754, CG, 130 nm, Low power)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
"Sonora" (Socket 754, D0, 90 nm, Low power)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
"Albany" (Socket 754, E6, 90 nm, Desktop replacement)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit
"Roma" (Socket 754, E6, 90 nm, Low power)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit
Mobile Athlon 64
"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
"ClawHammer" (CG, 130 nm, 35 W TDP)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
"Odessa" (CG, 130 nm, Desktop replacement)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
"Odessa" (CG, 130 nm, 35 W TDP)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
"Oakville" (D0, 90 nm, 35 W TDP Low Power)
MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
"Newark" (E5, 90 nm, 62 W TDP)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Turion 64
"Lancaster" (90 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
Kite platform (2006)
Introduced in 2006, the Kite platform consists of:
Mobile Sempron
"Keene" (Socket S1, F2, 90 nm, Low power)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
Turion 64
"Richmond" (90 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Turion 64 X2
"Taylor" (90 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
"Trinidad" (90 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Kite Refresh platform (2007)
AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.
Mobile Sempron
"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
Athlon 64 X2
"Tyler" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Turion 64 X2
"Tyler" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Puma platform (2008)
The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:
Mobile Sempron
"Sable" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
Athlon X2
"Lion" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Turion X2
"Lion" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Turion X2 Ultra
"Lion" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Yukon platform (2009)
The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.
Sempron
"Huron" (65 nm, Low power)
Athlon Neo
"Huron" (65 nm, 15 W TDP)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V
"Sherman" (65 nm, 15 W TDP)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
"Congo" (65 nm, 13 W TDP)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Turion
"Congo" (65 nm, 20 W TDP)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Congo platform (2009)
The Congo platform was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.
Athlon Neo X2
"Conesus" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V
Turion Neo X2
"Conesus" (65 nm)
MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!
Tigris platform (2009)
The Tigris platform introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:
Sempron
"Caspian" (45 nm)
Single-core mobile processor MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Athlon II
"Caspian" (45 nm)
Dual-core mobile processor MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Turion II
"Caspian" (45 nm)
Dual-core mobile processor MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Turion II (Ultra)
"Caspian" (45 nm)
Dual-core mobile processor MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Nile platform (2010)
The Nile platform introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:
V series
"Geneva" (45 nm)
Single-core mobile processor
Athlon II Neo
"Geneva" (45 nm)
Single-core mobile processor Single-core mobile processor Dual-core mobile processor
Turion II Neo
"Geneva" (45 nm)
Dual-core mobile processor
Danube platform (2010)
The Danube platform introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:
V series
Champlain (45 nm)
Single-core mobile processor
Athlon II
Champlain (45 nm)
Dual-core mobile processor
Turion II
Champlain (45 nm)
Dual-core mobile processor
Phenom II
Champlain (45 nm)
Dual-core mobile processor ** Triple-core mobile processors ** ** Quad-core mobile processors **
Brazos platform (2011)
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:
"Ontario" (40 nm)
"Zacate" (40 nm)
Sabine (Fusion) platform (2011)
The Sabine platform introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:
"Llano" (32 nm)
1 Unified shaders : Texture mapping units : Render output units
Brazos 2.0 platform (2012)
AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:
"Ontario", "Zacate" (40 nm)
Comal (Fusion) platform (2012)
The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:
"Trinity" (2012, 32 nm)
1 Config GPU are Unified shaders : Texture mapping units : Render output units
"Richland" (2013, 32 nm)
1 Config GPU are Unified shaders : Texture mapping units : Render output units
Jaguar (2013)
"Temash" (2013, 28 nm)
Elite Mobility APU: 1 Unified shaders : Texture mapping units : Render output units
"Kabini" (2013, 28 nm)
Mainstream APU: 1 Unified shaders : Texture mapping units : Render output units
Puma (2014)
Mullins, Tablet/2-in-1 APU
Beema, Notebook APU
Kaveri (2014)
Carrizo-L (2015)
Carrizo (2015)
Bristol Ridge (2016)
"Raven Ridge" (2017)
"Picasso" (2019)
"Renoir" (2020)
U
H
"Lucienne" (2021)
"Cezanne" (2021)
U
H
"Barceló" (2022)
"Rembrandt" (2022)
Mendocino (7020 series, Zen2/RDNA2 based)
Barcelo-R (7030 series, Zen3/GCN5 based)
Rembrandt-R (7035 series, Zen3+/RDNA2 based)
Phoenix (7040 series, Zen4/RDNA3 based)
Dragon Range (7045 series, Zen4/RDNA2 based)
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